As demand for heterogeneously integrated AI accelerator chipsets scale, IC substrates must support larger format interposer designs that interconnect larger number of chips and accommodate higher-density power delivery network (PDN) integration.
The data and power requirements driven by front-end advances, 3D chip-stacking, and interposer-focused 2.5D packaging demand more performance than traditional, flip‑chip ball grid array (FCBGA) substrates can provide. To address this need, innovations in hybrid coreless designs, new glass core materials, and much higher-density routing are increasing substrate design and fabrication complexity. Shrinking line/space (L/S) and microvia requirements in panel‑level packaging (PLP) are pushing the limits of photolithography accuracy and plating uniformity beyond modified semi‑additive process (mSAP) and semi‑additive process (SAP) capabilities. Scaling these advanced substrate technologies now depends on precise control of panel-scale processes for fabricating vertical metal interconnects, redistribution layers (RDL), within advanced laminate materials.
Qnity provides engineered materials that strengthen IC substrate fabrication from end to end. Our solutions enable reliable fine pitch panel RDL formation, enhance electrical and mechanical stability for AI and chiplet substrates, and support high uniformity panel metallization critical to next-generation routing density.
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