Artificial intelligence, hyperscalers, cloud and edge computing, and advanced networking are driving system integration requirements that push the limits of advanced packaging. To meet these demands, chip designers must move beyond conventional packaging strategies to scale chip-to-chip interconnects, and enable larger, heterogeneously integrated systems. Key challenges in cost, power delivery, thermal dissipation, and high bandwidth connectivity must be addressed to unlock advanced silicon architectures for modern compute workloads.
Qnity’s advanced materials and process technologies enable innovative designs across High Bandwidth Memory (HBM), 2.5D and 3D packaging, and heterogeneous integration with chiplets, interposers, and IC substrates. Engineered for silicon, organic, and glass platforms at wafer and panel scale, Qnity’s portfolio support advanced chips, interposers, and integrated circuit (IC) substrates.
Qnity’s broad materials portfolio enables high vertical interconnect density and data bandwidth while supporting reliable, high-yield fabrication of complex chipsets. Our wafer packaging technologies improve compute performance, power efficiency, and scalability through precise through‑silicon vias (TSV), fine pitch microbumps, dense redistribution layers (RDL), and copper pillars for hybrid bonding. Together, our materials support next-generation advanced packaging, enabling processes such as wafer thinning, metallization of through-glass vias (TGV) and 3D stacking with hybrid bonding.
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