The electronics inside today’s most advanced devices, from 5G smartphones to spacecraft to electric vehicles, depend on flex circuits that perform reliably in extreme conditions and high-frequency environments. Pyralux® flex circuit laminates and adhesive systems from Qnity are engineered to deliver the signal integrity and thermal resilience these applications require.
Qnity’s flex laminate and adhesive solutions are engineered for performance and reliability. By incorporating our own dielectric polyimides, Qnity offers copper clad laminates, coverlays, bondplys, and sheet adhesives designed to work seamlessly as a complete material system. Supported by decades of application expertise, engineers have access to hundreds of flex laminate configurations to meet demanding design requirements across high frequency antenna systems, wearable devices, space and aerospace platforms, and other advanced electronic applications. Through deep materials knowledge and system level integration, Qnity enables next generation designs that demand precision, durability, and technical excellence.
Copper clad laminates and flex circuit performance
Flexible laminates are the structural and electrical foundation of flex and rigid-flex printed circuit boards. A laminate consists of a polyimide dielectric substrate bonded to copper foil—either through an adhesive layer or, in constructions without an adhesive, through direct lamination or casting processes. The result is a thin, bendable circuit board material that can be routed into three-dimensional shapes, folded into tight spaces, and subjected to repeated flexing without failure.
Not all flex laminates are equal. The dielectric properties, mechanical strength, thermal stability, and adhesive chemistry of the laminate determine whether a design meets specification or fails in the field.
Pyralux® flex circuit laminates and adhesive systems are a comprehensive portfolio of flexible circuit laminates and adhesive systems spanning many adhesive chemistries and construction options. Qnity offers hundreds of variations in copper type, copper thickness, dielectric thickness, and adhesive chemistry, as well as the coverlays, bondplys, and sheet adhesives required to complete a multi-layer stackup. Built on Kapton® polyimide film, Pyralux® flex circuit laminates and adhesive systems are designed to support virtually any flex or rigid-flex circuit requirement.
Embedded capacitor laminates for rigid PCB power distribution
Interra® embedded capacitor laminates are designed for use in multilayer rigid printed circuit boards, purpose-built to optimize power distribution network performance. Built on Kapton® polyimide technology and offering superior mechanical strength, reliability, and capacitance stability, Interra® laminates reduce modal resonances, lower inductance, and decrease overall impedance, enabling designers to reduce required surface mount capacitors and simplify board design.
Superior bond strength and flexibility for high volume applications
Qnity adhesiveless all polyimide copper clad flexible laminates (CCL) are available in a wide variety of copper types, thicknesses and construction options.
Our family of epoxy-based adhesive solutions offers superior peel strength, chemical, and heat resistance.
Qnity’s family of fluoropolymer adhesive solutions delivers superior performance in high-speed and high frequency applications.
Interra® thin copper clad laminates for embedded capacitance.
Interra® embedded planar capacitor laminate is used to make thinner, more efficient power and ground planes within a multilayer printed wiring board.
Material selection for advanced flex circuits is rarely straightforward. Our experts help design engineers navigate material selection, optimize stackup, and troubleshoot fabrication challenges.
Use our interactive tool to explore the full Pyralux® portfolio, find product specs and data sheets, and identify the right flex laminate for your design needs.
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